Ops and ops cooling system

The open pluggable specification (OPS) helps standardize the design and development of digital signage devices and pluggable media players. Intel created OPS to address digital signage market fragmentation and simplify device installation, usage, maintenance and upgrades.

OPS enables digital signage manufacturers to deploy interchangeable systems faster and in higher volumes while lowering costs for development and implementation.

Installing digital signage equipment based on Intel architecture helps you implement scalable digital signage applications that can network easily with other equipment. This simplifies interoperability and application upgrades designed to meet the digital signage requirements of individual customers while helping to future-proof technology investments. 

The OPS in the conference tablet is a way to open it to plug and pull the computer module. In fact, it is also a microcomputer, which can be unplugged and used with the conference tablet, and is also widely used in industrial control, video surveillance, advertising machine, digital signage, KTV system and so on, etc. 

OPS microcomputer features: easy installation, use and maintenance of digital signals, make digital Kandevices more intelligent and integrated. 

Da Vinci Conference panel with ops: CPU:i5/i7 solid-state drive: 4g/8g/24g/128g/258g and CPU solid-state drive option. Increase the interaction of the meeting tablet in the meeting and improve the meeting efficiency. 

OPS thermal management and custom heat sink

OPS’s operating speed is constantly improved as the technology has been updated with incremental improvements.

For the OPS, the advantages OPS of operating speed is lied on used CPU and GPU running performance, and the CPU/GPU performance is by their power consumption level.

For example, the TDP of INTEL CORE i3, i5, i7 is 35W, 65W and 95W. When the OPS is working, an amount of heat is concentrated in OPS, the invariant rise and the concentrated heat inside the OPS influence the computer operation performance and even high-temperature alarm, and then the OPS can not work.

Drforge OPS custom heat sink designs are for solving the high-temperature problem and confirm that the computer works normally and effectively.

We use copper, heat pipe, aluminium fin, and fan assembly technical in our heat dissipation design. The copper base contacts CPU/GPU quickly brings the heat into heat pipes, and then heap pipe translates the heat to density fin, by a working fan, the heat is flowed out of the CPU/GPU. the heat pipe heat sink system confirms the working temperature of CPU/GPU and the chassis can be at a certain suitable temperature value. Generally keep the working temperature CPU/GPU of full power consumption is not more than 85℃.

The OPS has different overlooking, size, and motherboard towards small size; for example, below heat sinks are used on motherboard only 119*180*30mm.

OPS with higher performance requirements, like RK3399, the dissipation power consumption is 65W. An aluminium heat sink is unable to meet the heat dissipation requirements. So, we used two copper heat pipes and framed fan-type radiator (cooling fan) to achieve the OPS has a stable working temperature.

Normally, we design the electronic heat sinks is according to ending products structure, air space and performance. According to user requirements, adding the heat pipe quantities, fins and improving the cooling fan to lower your cost and confirm the production process quality.